Tag: Flip Chip Technology Market Revenue

Global Flip Chip Technology Strategic Business Report 2018: Flip Chip Technology Tackle Demand – A Major Concern for Manufacturers

Global Flip Chip Technology Strategic Business Report 2018: Flip Chip Technology Tackle Demand – A Major Concern for Manufacturers

In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The APAC held a large share of the overall flip chip technology market in 2017.
Over the next five years, Publisher projects that Flip Chip Technology will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

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This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip Technology market by product type, application, key manufacturers and key regions.
To calculate the market size, Publisher considers value and volume generated from the sales of the following segments.
Segmentation by product type:

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Segmentation by application:
Consumer electronics
Industrial sector
Medical devices
Smart technologies
Military & aerospace

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Some Points From Table of Content:

1 Scope of the Report

2 Executive Summary

3 Global Flip Chip Technology by Players

4 Flip Chip Technology by Regions

5 Americas


7 Europe


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