Tag: Flip Chip Technology Market Forecast

Global Flip Chip Technology Strategic Business Report 2018: Flip Chip Technology Tackle Demand – A Major Concern for Manufacturers

Global Flip Chip Technology Strategic Business Report 2018: Flip Chip Technology Tackle Demand – A Major Concern for Manufacturers

In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The APAC held a large share of the overall flip chip technology market in 2017.
Over the next five years, Publisher projects that Flip Chip Technology will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

 Request Sample Report @ http://www.orbisresearch.com/contacts/request-sample/2312584

This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip Technology market by product type, application, key manufacturers and key regions.
To calculate the market size, Publisher considers value and volume generated from the sales of the following segments.
Segmentation by product type:
FC BGA
FC PGA
FC LGA
FC QFN
FC SiP
FC CSP 

Browse Complete Report@ http://www.orbisresearch.com/reports/index/2018-2023-global-flip-chip-technology-consumption-market-report

Segmentation by application:
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace

Enquiry Before Buying@ http://www.orbisresearch.com/contacts/enquiry-before-buying/2312584

Some Points From Table of Content:

1 Scope of the Report

2 Executive Summary

3 Global Flip Chip Technology by Players

4 Flip Chip Technology by Regions

5 Americas

6 APAC

7 Europe

Continued…

About Us:

Orbis Research (orbisresearch.com) is a single point aid for all your market research requirements. We have vast database of reports from the leading publishers and authors across the globe. We specialize in delivering customized reports as per the requirements of our clients. We have complete information about our publishers and hence are sure about the accuracy of the industries and verticals of their specialization. This helps our clients to map their needs and we produce the perfect required market research study for our clients.

Contact Us:

Hector Costello

Senior Manager – Client Engagements

4144N Central Expressway,

Suite 600, Dallas,

Texas – 75204,U.S.A.

Phone No.: +1 (214) 884-6817; +9120641 01019

Email id:  sales@orbisresearch.com