Semiconductor packaging is carried out to provide extra
protection to wafers or substrates. The package casing is made up of materials
such as metal, plastic, glass, or ceramic and contains one or more
semiconductor electronic components.
Accounting for more than 55% of the total market shares, the die-level packaging equipment segment dominated the market. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.
According to this market study, the OSATs will account for more than 58% of the total market shares and will also dominate the semiconductor packaging equipment market throughout the predicted period. The migration of a number of semiconductor manufacturers to the fabless model is identified to be the major factor for the growth of the market segment. Additionally, the development of new technologies such as FOWLP, 2.5D, and TSV has also increased the outsourcing of back-end processes, which will also fuel the growth of this market segment.
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The Semiconductor Packaging Equipments market was valued at
xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a
CAGR of xx% during the forecast period. In this study, 2018 has been considered
as the base year and 2019 to 2025 as the forecast period to estimate the market
size for Semiconductor Packaging Equipments.
This report presents the worldwide Semiconductor Packaging Equipments market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.
The following manufacturers are covered in this report:
ASM Pacific Technology
Kulicke and Soffa Industries
Tokyo Electron Limited
Jiangsu Changjiang Electronics Technology
Semiconductor Packaging Equipments Breakdown Data by Type
Die-Level Packaging Equipment
Wafer-Level Packaging Equipment
Semiconductor Packaging Equipments Breakdown Data by Application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)
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Table of Contents:
Chapter One: Study Coverage
Chapter Two: Executive Summary
Chapter Three: Market Size by Manufacturers
Chapter Four: Semiconductor Packaging Equipments Production by Regions
Chapter Five: Semiconductor Packaging Equipments Consumption by Regions
Chapter Six: Market Size by Type
Chapter Seven: Market Size by Application
Chapter Eight: Manufacturers Profiles
Chapter Nine: Production Forecasts
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