3D TSV is a vertical electrical connection
(via) that passes completely through a silicon wafer or die. TSVs are high
performance interconnect techniques used as an alternative to wire-bond and
flip chips to create 3D packages and 3D integrated circuits. Compared to
alternatives such as package-on-package, the interconnect and device density is
substantially higher, and the length of the connections becomes shorter.
According to this study, over the next five years the 3D TSV market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2023, from US$ xx million in 2017. In particular, this report presents the global market share (sales and revenue) of key companies in 3D TSV business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of 3D TSV market by product type, application, key manufacturers and key regions and countries.
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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Advanced Semiconductor Engineering
Taiwan Semiconductor Manufacturing Company
Jiangsu Changing Electronics Technology
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This study considers the 3D TSV value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2013 to 2018, in Section 2.3; and forecast to 2023 in section 11.7.
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Segmentation by application: breakdown data from 2013 to 2018, in Section 2.4; and forecast to 2023 in section 11.8.
Information and Communication Technology
Military, Aerospace and Defence
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Table of Contents:
1 Scope of the Report
2 Executive Summary
3 Global 3D TSV by Players
4 3D TSV by Regions
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
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