Global LED Encapsulation Market Size, Market Share, Application Analysis, Regional Outlook, Growth Trends, Key Players, Competitive Strategies and Forecasts, 2018 to 2023

Global LED Encapsulation Market Size, Market Share, Application Analysis, Regional Outlook, Growth Trends, Key Players, Competitive Strategies and Forecasts, 2018 to 2023

Encapsulation is generally adopted in packaging of lamp-LEDs. The encapsulation procedure is to pour liquid epoxy into the LED moulding chamber first, and then insert the LED bracket that has undergone the press welding, then put the mould into the oven, and the LED gets shaped when the epoxy solidifies.

Over the next five years, it is projected that LED Encapsulation will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

This report covers the present scenario (with the base year being 2017) and the growth prospects of global LED Encapsulation market for 2018-2023.

This report presents a comprehensive overview, market shares, and growth opportunities of LED Encapsulation market by product type, application, key manufacturers and key regions.

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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:

Dow

Nusil

H.B. Fuller

Shin-Etsu Chemical

Henkel

KYOCERA

Hitachi Chemical

Panasonic

Epic Resins

Intertronics

 

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To calculate the market size, it is considered value and volume generated from the sales of the following segments:

 

Segmentation by product type:

Epoxy

Silicone

Polyurethane

 

Segmentation by application:

Consumer electronics

Automotive

Telecommunication

Medical

 

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Some Points From Table of Content:

1 Scope of the Report

2 Executive Summary

3 Global LED Encapsulation by Players

4 LED Encapsulation by Regions

5 Americas

6 APAC

7 Europe

8 Middle East & Africa

Continued…

 

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