Hybrid Integrated Circuit (HIC) used a film forming technique to fabricate a passitive components and be assemblied with semiconductor devices, bonded to a substrate. The passsitive components are generally resistors, inductors, transformers or capacitors. The semiconductor devices, such as transistors or diodes, is used in HIC.
Thick-Film Hybrid Integrated Circuit is a kind of HIC with the thick-film technology, and the thick –film technology is used as a interconnecting medium for hybrid integrated circuit.
The global market of Thick-Film Hybrid Integrated Circuit Industry is really scattered due to the wide application and consumption scale.
The price of Thick-Film Hybrid Integrated Circuit is slightly decreased in nearly five years. For being accorded with the corresponding application area, the product price has a large differences.
Over the next five years, it is projected that Thick-Film Hybrid Integrated Circuits will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of Thick-Film Hybrid Integrated Circuits market by product type, application, key manufacturers and key regions.
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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Integrated Technology Lab
To calculate the market size, it is considered value and volume generated from the sales of the following segments:
Segmentation by product type:
96% Al2O3 Ceramic Substrate
BeO Ceramic Substrate
Segmentation by application:
Avionics and Defense
Telecoms and Computer Industry
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Some Points From Table of Content:
1 Scope of the Report
2 Executive Summary
3 Global Thick-Film Hybrid Integrated Circuits by Players
4 Thick-Film Hybrid Integrated Circuits by Regions
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