2018 Research: Global Die Bonder Equipment Market Forecast 2023 Report

Global Die Bonder Equipment Market 2018 by Manufacturers, Countries, Type and Application, Forecast to 2023 Provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments.

Global Die Bonder Equipment Market 2018-2023

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass

Scope of the Global Die Bonder Equipment Market Report

This report focuses on the Die Bonder Equipment in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

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The worldwide market for Die Bonder Equipment is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.

Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.

With the increasing in production capacity, expected that the Die Bonder Equipment raw material price will be stable in the short term. However, the improvement of energy, transportation costs, and labor costs, will play a significant role in promoting the cost of Die Bonder Equipment.

The average price of Die Bonder Equipment will fall further. The product average price trend in the past few years was not stable, however, due to the mature manufacturing technology, cost of raw materials, as well as the substitute threat, the average price will decrease in the few future years.

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This report covers Analysis of Global Die Bonder Equipment Market Segment by Manufacturers

Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond

Global Die Bonder Equipment Market Segment by regional analysis covers 

North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

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Global Die Bonder Equipment Market Segment by Type

Fully Automatic
Semi-Automatic
Manual

Global Die Bonder Equipment Market Segment by Applications, can be divided into

Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

Some of the Points cover in Global Die Bonder Equipment Market Research Report is:

Chapter 1: Describe Die Bonder Equipment  Industry

  • Introduction,
  • Product Scope,
  • Market Overview,
  • Market Opportunities,
  • Market Risk,
  • Market Driving Force

Chapter 2: To analyze the top manufacturers of Die Bonder Equipment Industry in 2016 and 2017

  • Sales
  • Revenue and price

Chapter 3: Competitive analysis among the top manufacturers in 2016 and 2017

  • Sales
  • Revenue and market share

Chapter 4: Global Die Bonder Equipment  Market by regions from 2013 to 2018

  • Sales
  • Revenue and market share

Chapter 5, 6, 7 and 8: Global Die Bonder Equipment Market by key countries in these regions

  • Sales
  • Revenue and market share

Chapter 9 and 10: Global Die Bonder Equipment Market by type and application from 2013 to 2018

  • Sales
  • Revenue and market share
  • Growth rate

Chapter 11:Die Bonder Equipment Industry Market forecast from 2018 to 2023

  • Regions
  • Type and application with sales and revenue

Chapter 12 and 13:Die Bonder Equipment Industry

  • Sales channel
  • Distributors
  • Traders and dealers
  • Appendix
  • Data source

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