Global Electrostatic Chucks for Wafer Strategic Business Report 2018: Electrostatic Chucks for Wafer Tackle Demand – A Major Concern for Manufacturers

The Electrostatic Chucks (ESC) is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.

Over the next five years, Publisher projects that Electrostatic Chucks for Wafer will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

This report presents a comprehensive overview, market shares, and growth opportunities of Electrostatic Chucks for Wafer market by product type, application, key manufacturers and key regions.

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To calculate the market size, Publisher considers value and volume generated from the sales of the following segments:

Segmentation by product type:
Coulomb Type Electrostatic Chucks
Johnsen-Rahbek (JR) Type Electrostatic Chucks

Segmentation by application:
300 mm Wafer
200 mm Wafer
150 mm Wafer
Others
 

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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed
Others

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Some Points From Table of Content:

1 Scope of the Report

2 Executive Summary

3 Global Electrostatic Chucks for Wafer by Players

4 Electrostatic Chucks for Wafer by Regions

5 Americas

6 APAC

7 Europe

Continued…

 

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