Orbis Research Inclusive Report: Global Next Generation Memory Market Report has been prepared based on an in-depth market analysis with inputs from industry experts.
Markets and Trends– Global Next Generation Memory Market 2017-2021
The Following Companies as the Key Players in the Global Next Generation Memory Market: Cypress Semiconductor, Fujitsu, Intel, IBM, Micron Technology, ROHM Semiconductor, Samsung Electronics, Texas Instruments, and Toshiba.
Other Prominent Vendors in the market are: Adesto Technologies, Crossbar, and Everspin Technologies.
Commenting on the report: “One trend in market is growing emergence of new FeRAM design using CMOS processes. Researchers have designed flexible FeRAM devices using state-of-the-art CMOS processes that involve sputtering, photolithography, and reactive ion etching. Their research led to a reduction in the gap between a rigid, inflexible semiconductor, which has high integration density, performance, and yield, and highly flexible polymer/hybrid materials that are low-performance electronics. To reduce the thickness of traditional silicon wafers and make electronics flexible, researchers used the existing standard CMOS fabrication processes.”
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According to the report, one driver in market is low power consumption. Next-generation memory technologies are mostly used in battery-powered wireless sensors, as they consume approximately 50% less power than other flash memories. This increases the battery life, leading to a reduction in maintenance costs. Thus, vendors in the market get the advantage to compete based on prices. Moreover, due to lesser power consumptions, users prefer buying devices integrated with the next-generation memory technologies as their expenses also get reduced. In addition, next-generation memory technologies have the unique feature of a faster wake-up time. They also eliminate the need for data saving and restoring, unlike other flash memories. This gives next-generation memory technologies an additional benefit over other RAMs, along with the advantage of lower power consumption. Next-generation memory technologies help in the automatic update of systems, especially in wireless applications. All these factors attract device manufacturers and end-users, which will drive the adoption of these technologies during the forecast period.
Further, the report states that one challenges in market is cyclical nature of semiconductor industry. The cyclical nature of the semiconductor equipment industry affects operating results of equipment vendors due to severe downturns. The equipment manufacturers face risks such as overcapacity, low demand, and high price competition. Changes in customer requirements due to new manufacturing capacity and advances in technology affect equipment manufacturers considerably. Semiconductor manufacturing equipment vendors are largely affected by their capital expenditure. Device manufacturers reduce their capital expenditure and demand for semiconductor manufacturing equipment during the overcapacity period. During the cyclical period, there is a reduction in purchases, delay in delivery dates, and order cancellations by customers. This, in turn, results in reduction of net sales, backlogs, delays in revenue recognition, and excess inventory for the vendors, which poses a major threat to vendors’ operations. In addition, the high price competition due to their low demand in the market affects their gross margins.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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